Electronic devices generate
heat by themselves and in many cases they work in high temperature conditions.
Overheating of electronic devices is one of the critical factors affecting device
reliability and performance. Heat generated by electronic devices must be dissipated to improve reliability and prevent premature failure. Techniques for
heat dissipation can include heatsinks and fans for air cooling, and other forms of computer cooling such as liquid cooling.
Electronic devices manufacturers need to analyze
heat generation and dissipation of electronic components, take decisions on their placement, cooling devices required, their placement and performance - this analysis is called
thermal design and
thermal management. Thermal design should be performed on the product early design stage, together with reliability analysis. If it was not done, or if electronic components overheating is discovered on the manufacturing or field use stages, thermal management could help and give answers on how to improve the situation - how to change component placement, which cooling facilities to add and where.
The best approach to thermal design and management is
thermal modelling - simulation of airflows and heat transfer flows inside the system. Thermal modeling answers questions about airflow and temperature distribution, size and number of the fans, influence of the configuration changes and failures of fans. We are using the FloTHERM-powerful 3D computational fluid dynamics software that predicts airflow and heat transfer in and around electronic equipment, including the coupled effects of conduction, convection and radiation. It enables engineers to create virtual models of electronic equipment, perform thermal analysis, and test design modifications quickly and easily before any physical prototypes are built.
ALD thermal management team has been the dependable source of the thermal design for electronic systems services since the ALD establishment. Our thermal experts combine the deep knowledge of heat transfer and thermodynamics with sophisticated usage of the thermal analysis software. This combination ensures accuracy and innovation in the thermal management of the most complicated electronic project.
See also:
Thermal Design
Thermal Modeling
Thermal Analysis and Thermal Management Services
